The SMT Industry Abbreviation: A Beginner’s Guide to Understanding the Technology

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  • SMT: Surface Mount Technology
  • PCB: Printed Circuit Board
  • BGA: Ball Grid Array
  • QFN: Quad Flat No-leads
  • CSP: Chip Scale Package
  • LGA: Land Grid Array
  • QFP: Quad Flat Package
  • SOIC: Small Outline Integrated Circuit
  • SOP: Small Outline Package
  • TQFP: Thin Quad Flat Package
  • TDR: Time-domain reflectometry, a measurement technique that uses a pulse signal to measure the electrical characteristics of a PCB or SMD.
  • V-score: A process of scoring or grooving the PCB substrate to make it easier to separate the PCB after assembly.
  • PCB Panel: A large PCB divided into smaller individual PCBs, which are later separated and used as individual PCBs.
  • Panel Array: A group of identical SMDs placed on a PCB panel in a matrix arrangement.
  • PCB trace: A thin conductor on the surface of a PCB that connects one component to another.
  • Via: A small hole in a PCB that connects one layer of a PCB to another or connects the surface of the PCB to an internal layer.
  • Solder mask: A thin layer of polymer that covers the surface of a PCB to protect the traces and vias from damage and to provide insulation.
  • Solder paste: A mixture of tiny solder particles suspended in flux that is used to create the solder joints between SMDs and a PCB.
  • SMD: Surface Mount Device
  • PTH: Plated Through-Hole
  • BOM: Bill of Materials
  • stencil: a thin metal or polymer sheet with cutouts in the shape of the SMD pads, used to apply solder paste to the PCB before components are placed.
  • Reflow: The heating process that melts the solder paste and causes it to flow and solidify, creating a mechanical and electrical connection between the SMD and the PCB.
  • Pick and Place: The process of loading SMDs onto a PCB using a machine.
  • AOI: Automated Optical Inspection, A machine that uses cameras and software to inspect the placement and alignment of SMDs on a PCB.
  • ICT: In-Circuit Test, A test that verifies the electrical functionality of a PCB by applying test signals and measuring the response.
  • FCT: Functional Circuit Test, A test that verifies the functional performance of a PCB by applying real-world signals and measuring the response.
  • DFM: Design for Manufacturability, the practice of designing a PCB with consideration for the capabilities and constraints of the SMT assembly process.
  • DFT: Design for Testability, the practice of designing a PCB with consideration for the ability to test the functionality of the finished product.
  • ESD: Electrostatic Discharge, the release of static electricity that can cause damage to electronic components.
  • RoHS: Restriction of Hazardous Substances, a European Union directive that limits the use of certain hazardous materials in electronic products.
  • Lead-free: A term used to describe electronic components and materials that do not contain lead in compliance with RoHS regulations.
  • SIR: Surface Insulation Resistance, a measurement of the resistance to electrical leakage on the surface of an SMD.
  • CT: Capacitance Test, a measurement of the capacitance of an SMD.
  • LCR: Inductance, Capacitance and Resistance Test, a measurement of the inductance, capacitance and resistance of an SMD.
  • TDR: Time-domain reflectometry, a measurement technique that uses a pulse signal to measure the electrical characteristics of a PCB or SMD.
  • V-score: A process of scoring or grooving the PCB substrate to make it easier to separate the PCB after assembly.
  • PCB Panel: A large PCB divided into smaller individual PCBs, which are later separated and used as individual PCBs.
  • Panel Array: A group of identical SMDs placed on a PCB panel in a matrix arrangement.
  • PCB trace: A thin conductor on the surface of a PCB that connects one component to another.
  • Via: A small hole in a PCB that connects one layer of a PCB to another or connects the surface of the PCB to an internal layer.
  • Solder mask: A thin layer of polymer that covers the surface of a PCB to protect the traces and vias from damage and to provide insulation.
  • Solder paste: A mixture of tiny solder particles suspended in flux that is used to create the solder joints between SMDs and a PCB.

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